Each Special Assembly Process Requires a Special Tool.
Our systems offer a broad spectrum.
There are many more assembly processes than just the bonding ones. Among these are jobs that are more complex than others. For these special tools are required.
THE FLIP CHIP PROCESS – the non-wired version of a housed component. Bumps and face down rotation come into the game here. This is a state-of-the-art technology especially with small items.
UV-CURING – freshly assembled components cannot be moved right away but need to be hardened (e.g. for immediate transport after production). The UV-curing function is designed to do this job.
SOLDERING – here components are bonded via a thermal process. In the soldering station the user has the choice of diverse process steps and types.
PROCESS MONITORING CAMERA – this type of camera enables a perfect overview of all running processes. A very precise observation is the more important the smaller the components are.
The Flipchip Process.
Less Wire-Bonding. More Flip Chip Assembly.
Wiring loses its importance the smaller the components get.
BUMPS INSTEAD OF WIRES. THAT’S MORE (TOMORROW’S) STATE-OF-THE-ART.
Today still a majority of all worldwide produced microchips come in their housed form as wired chips. But as the components grow smaller and smaller the elimination of the wires is much more advantageous for some industry production. Hence, the use of more complex assembly processes seem rational. The flipchip technology is the solution. Small bumps are used to connect the chip with the substrate while being rotated (flipped) face down.
PERFECT ASSEMBLY. THE AMADYNE FLIP STATION.
We offer the basic tool and controlling conditions for simple flipchips. With our more universal flip-station components can be rotated within a range of 200µm to 30mm edge lengths irrespective of the source (wafer, tape, wafflepack). Assisted by the dipping unit the bumps can be precisely coated with solder or flux and in the next step be inspected and finally assembled.
Professional Handling of Freshly Produced Substrates.
Adhesive, Hardening & Shock Protection.
IF YOU SHOULD BE IN A HURRY …
To harden common adhesives time is needed and often the use of temperature influence is also required. This means freshly assembled components are not fit for transport or other activities where any form of movement is a condition. There are many situations where the assembled production result must be kept unmoved for some time. If customers can’t spare this time UV curing is the right solution.
… E.G. FOR IMMEDIATE TRANSPORT AFTER FINAL PRODUCTION.
UV curing works like this: during the process when the component is still in hold of the tool strong UV-LEDs harden the special UV-adhesive within seconds. After this job the assembled result cannot change anymore. There’s an alternative process where the hardening is processed in a special station – parallel to the general assembly.
Soldering (Station and Toolheating).
Fully Automatic Soldering.
Elegant, User-Friendly & Perfect. As You Like It.
THE AMADYNE-SOLDERING STATION IS INDEED VERY FLEXIBLE.
During the soldering process components are bonded by the use of a thermic process. The connection can have a mechanical and an electrical function and be used as a heat conductor. The substrate (or many substrates) can be placed into the soldering station automatically. In case the solder has already been transferred to the substrate or onto the component the latter one will be placed on the substrate.
ELEGANT SOFTWARE CONTROL DESIGN. DIVERSE PROFILE DEPOSITS. AND MORE.
As an intermediate step the solder coating can be performed as Dispensing, Stamping, Dipping or as preform. The software allows to deposit a temperature profile. In addition the process space can be closed and flooded with inert or process gas. It is also possible to keep the component in place by the use of a heated tool. After the thermal process the finished package is automatically ejected and the station is made ready for the next step.