Classical SMD-components stringed on tapes and reeled must be removed.
Here, the loading and unloading process of substrates is controlled and proceeded according to very exact time and place requirements. Other important keywords associated with this systems are: off-sorting, piercing, shroud, wafflepack.
The Die Ejector.
The Direct Die-Release from a Wafer.
NO EXPENDITURE OF TIME.
The die-ejector mechanism is designed to directly remove naked microchips deposited on a frame stringed on adhesive film. Processed and readily cut components can so serve as direct source which makes further time- and money consuming procedures irrelevant.
EXTENSIVE SUPPORT AND CONSULTING BY AMADYNE.
The die-ejector uses vacuum to remove the dies from the film. Moreover, needles form a part of this process. Needles either pierce the film or deform it in a way that it gives leave to the component (non-piercing) usually fixed more strongly on the strap material. The configuration of number of needles, vacuum surface and total arrangement must be adjusted very accurately as to the optimal assembly of the component. AMADYNE offers great support and consulting services here.
Releasing shrouds and Dies in a Pulsing Procedure.
FROM THE REEL INTO THE PRODUCTION. IN NO TIME.
Classical SMD components come as belted items on reels. The tapefeeder’s role is to remove chips from the belt and load just one component in each clock cycle into the process. This process must – like all other processes of this sort – function in a most accurate way.
SIMULTANEOUS SETUP WITH UPTO 36 REELS.
AMADYNE automation systems support a simultaneous setup with upto 12 triple-track tapefeeders which equals 36 reels with SIEMENS-protocol (e.g. Siemens or Hover Daves). The reel docking is external.
The (Wafer-) Magazine Lift.
Our Magazine lift: What a Solution!
And it is fast. Realized by a clever external loading mechanism.
MULTICHIP: SHOULD THERE BE NOT ENOUGH SPACE …
For multichip products (consisting of several diverse components – i.e. more than 50) the machine’s space is often not sufficient.
Then the magazine lift can store several trays equipped with wafers, gelpacks and Waffle Packs externally. Time and money can be saved by this solution. With the loading process thus being much faster (in the range of seconds) our customers take great advantage.
… THIS IS NOT A PROBLEM. THE MAGAZINE LIFT CAN SOLVE IT EASILY.
In total 25trayscan be loaded. Each tray can hold upto 16 2” waffle packs or one wafer upto 8”. The whole process runs as smoothly as to fully satisfy customers who must be sure that even components down to a size of 200µm edge length stay unmoved in their waffle packs.
LINE-CHAINS, BUFFERED CHAINS, INPUT AND OUTPUT LIFTS.
The automatic transport system is responsible for loading and unloading of the substrates. It can operate line-chains, buffered chains, input and output lifts.
SELECTABLE TRANSPORT DIRECTION. AND MORE.
The Automatic AMADYNE-transport system enables the handling of substrates and boats up to a length of 550 mm. It also enables a breadth between 20 mm and 30 mm. The transport direction is selectable, so is the operation with a one-side connected loader / unloader. The chaining is normally realized by a standardized SIEMENS interface.
The feed variants can be easily controlled using the software.