Single Chip. Multi Chip. Flipchip.
The assembly organization starts here.
PHASE ONE. MICROCHIP UNHOUSED.
Irrespective of the kind of unhoused chips that arrive at the AMADYNE production and inspection systems (Wafer, Tape etc.) – they have undergone a prior production job which is subject to risk and so the chance potential damage cannot be excluded.
PHASE TWO. MICROCHIP GETTING HOUSED.
The second phase takes place on the workspace of the AMADYNE systems. Like the prior process there is full automation, great complexity but no risk. Components must be removed from wafer or tape, then housed, bonded etc. Today several options are standard such as Single Chip (SC), Multichip Module (MCM) and Flipchip (FC). Parts showing damage are detected automatically and sorted out. There is more information: here.
The next-to-zero risk on our systems is a paramount sales argument for AMADYNE machines. As a matter of fact if there is discard it has origin only in the component delivery, not in the assembly processes. Our understanding of quality.
The Single Chip.
Quite Common. Quite Classical. Much in Demand.
CHIP ON SUBSTRATE. QUITE SIMPLE IN THE FIRST PLACE.
The definition is simple: bonding just one component on just one substrate is called a ‘single-chip product’. Classical examples are small LEDs, pressure sensors, classical ICs and most of CPUs and MCMs.
ON SECOND THOUGHT NOT SO EASY.
For a typical SC-application only one set of tools and material feed is required. As a matter of fact such an application is not very challenging. However, when there is just a bit more requirement (such as a special process, a special adhesive, documentation, inspection etc.) simple and lower cost machines fall far behind systems like AMADYNE machines.
Multichip Module (MCM).
Perfect microchip assembly in a single work operation.
SEVERAL DIFFERENT COMPONENTS ON ONE MCM.
On a single MCM many microchips can be positioned and the system is able to accomplish such jobs in one work operation only. This requires a great deal of software intelligence and hardware capabilities. In addition, diverse components need diverse tools necessary which are made available by the machine.
PROFESSIONAL SUPPORT BY OUR SYSTEMS.
AMADYNE systems support an automatic change process with up to 20 pick- up tools, the feeding of up to 36 x 8mm SMD Tapes, Wafer, Waffle Packs, Gel Packs, JEDEC-Trays and more. The complete Work Space can be made available for component feeding (e.g. 40 waffle packs). The optional Magazine Lift can support operations with up to 250 x 2? waffle packs or 15 wafers (also mixed). With this comprehensive support any demanding production job can be realized.
Less Wire-Bonding. More Flip Chip Assembly.
Wiring loses its importance the smaller the components get.
BUMPS INSTEAD OF WIRES. THAT’S MORE (TOMORROW’S) STATE-OF-THE-ART.
Today still a majority of all worldwide produced microchips come in their housed form as wired chips. But as the components grow smaller and smaller the elimination of the wires is much more advantageous for some industry production. Hence, the use of more complex assembly processes seem rational. The flipchip technology is the solution. Small bumps are used to connect the chip with the substrate while being rotated (flipped) face down.
PERFECT ASSEMBLY. THE AMADYNE FLIP STATION.
We offer the basic tool and controlling conditions for simple flipchips. With our more universal flip-station components can be rotated within a range of 200µm to 30mm edge lengths irrespective of the source (wafer, tape, wafflepack). Assisted by the dipping unit the bumps can be precisely coated with solder or flux and in the next step be inspected and finally assembled.