The Special Tools
Special assembly processes for special requirements.
AMADYNE systems offer a wide range.
Not all assembly processes are limited to simply bonding components. Some methods are more complex and therefore require appropriate tools.
- Flip Chip – Without any wire at all, which places particularly high demands on the assembly. Here, bumps or balls are used on the active side of the component, which then form an electrical contact with the substrate. This technology becomes more interesting the higher the frequencies used or the higher the number of contacts are.
- UV Curing – If the position of the components is absolutely critical, freshly assembled substrates must not always be moved before the adhesive has set. In this case, it helps to pre-cure or cure the adhesive during placement.
- Soldering – Here, components are metallurgically (eutectically) bonded to the substrate via a thermal process. Different process profiles can be freely programmed in the soldering station.
- Pocess Monitoring Cam – It provides a perfect insight into the running process. Especially with small chips and critical processes, it is enormously helpful to always have an additional eye directly on the action.
- Globtop finally, the dispenser, which is usually available anyway, is used to directly cast mechanically sensitive parts by means of convenient software.
The Flipchip Process.
Wire bonding becomes less. Flipchip becomes bigger.
We turn your components upside down.
BUMPS INSTEAD OF WIRES. TECHNOLOGY OF TODAY.
To date, most (smaller) chips have been bonded to substrates and then connected to the outside world by bonding wires. In some cases (for example, at particularly high frequencies or contact numbers), however, eliminating these wire connections promises such great advantages that it is worth carrying out more complex assembly processes for this purpose. Flipchip technology provides the active side of the chip with small contact points (bumps), turns the chip with the contact side down and connects it directly to the substrate via the bumps.
THE AMADYNE FLIPSTATION. THAT’S WHERE IT STARTS.
We are not the Flip Chip King and don’t want to be. But we do offer the basic tools for processing simpler flip chips. With our universal flip station, components between 200µm and 30mm edge length can be flipped regardless of the delivery form (wafer, waffle pack, tape etc.). Using the dipping unit, the bumps can be wetted with solder or flux with high precision, then measured or inspected via the ULC and finally assembled.
UV-Curing.
Professional handling of freshly mounted substrates.
Accuracy is not a gift that should be given away.
THOSE WHO INVEST A LOT OF EFFORT IN HIGH-PRECISION ASSEMBLY…
The adhesives usually used cure relatively slowly and often only under the influence of temperature. Depending on the adhesive used, freshly assembled substrates are therefore quite sensitive to vibrations during handling and transport. In some cases, however, the exact position of a component, which has been painstakingly measured, must be able to be held stable immediately. In such cases, UV curing in the production is the ideal solution.
…DOES NOT WANT TO SEE ITS COMPONENTS FLOAT AWAY.
Directly during placement, while the component is still held by the tool, powerful UV LEDs irradiate the UV-curing adhesive, which cross-links in a few seconds to such an extent that the component can no longer move. This ensures that the specified position no longer changes. Alternatively, UV curing can also be carried out parallel to the assembly process in a separate assembly station.
Soldering (Station and Toolheating).
Soldering fully automatic.
Elegant, user-friendly, flexible.
THE AMADYNE SOLDERING STATION IS REALLY VERSATILE.
In soldering, components are metallurgically (eutectically) connected to the substrate via a thermal process. The connection usually has both an electrical and a thermal function. Depending on the handling possibilities, one or more substrates can be automatically placed in the soldering station. Any number of components can be placed in the station and soldered individually or cumulatively at the end.
ELEGANT OPERATION. VERSATILE PARAMETERS PROGRAMMABLE.
As an intermediate step, the solder can also be applied in the form of dispensing, stamping, dipping or as a preform. The software allows the user to define a temperature profile for each individual component, if necessary. In addition, the process area can be closed and flooded with inert or process gas. It is also possible to hold the component in position with a heated tool. After the thermal process, the assembled component is automatically removed from the station and the station is refilled.
The Process Monitoring Camera.
A scrutinising look at the process never hurts.
This way you are always on the safe side. You observe the process live.
CONSTANT PROCESS OVERVIEW. ESPECIALLY WITH VERY SMALL COMPONENTS.
The process monitoring camera (PMC) gives the user a direct view at the location of the process. Because the components in microsystems technology (as the name suggests) are often very small, it is always difficult to adjust processes or monitor them during ongoing production. That’s where an extra eye comes in handy.
AT THE SCENE OF THE ACTION. THE CAMERA SEES EVERYTHING.
The PMC is mounted directly on the axis that carries the tool and thus always sees exactly the right spot. It provides a sharp colour image for the user with the help of which the user can conveniently follow the pick & place process or the glue application and optimise it if necessary. And if necessary, the image can even be recorded so that the process can be analysed in more detail later.
Globtop. Safely sealed.
The Globtop Process.
Protection of sensitive parts through special grouting.
GLOB TOP IS LESS EXPENSIVE IN MANY CASES…
In the glob top process, the mechanically sensitive parts (chips, wirebonds) of a circuit previously constructed mostly as a COB are protected by covering them with a special potting compound. In some cases, this is more robust, space-saving or simply more cost-effective than the complete encapsulation of the entire circuit.
…AS AN ENCAPSULATION.
Our machines support this process in conjunction with the standard dispensers by means of special software that enables the convenient build-up of dams and the automatic filling of larger volumes. The globtop operation can also be incorporated directly into the production process. This product protection option provided by AMADYNE shows once again how an investment in AMADYNE products can save costs several times over.