Processes.
Flipchip. Dispensing, Probing.
A short tour through the AMADYNE process arena.
A MACHINE’S HEART AND BRAIN.
A professional fully-automated microchip assembly production process is a quite complicated job and to get it realized great engineering talent is required. In such a system the internal processes stand in the foreground. They are, as it were, heart and brain at the same time. Supported by such processes users can both produce in a swift manner and create a high quality output. Here the processes are listed and interested visitors to this website can learn more.
SWIFT AND HIGH-QUALITY PRODUCTION.
In the organization sector of Processes the housing methods SC (Single Chip), Flipchip (FC) and MCM (Multichip Module) are to be mentioned. In the sector Connection Technology there are features and functions such as Dispensing, Stamping, UV Curing and Soldering. Speaking of Special Processes Component Inspection and Probing are interesting features.
Organisation.
Single Chip. Multi Chip. Flipchip.
The assembly organization starts here.
PHASE ONE. MICROCHIP UNHOUSED.
Irrespective of the kind of unhoused chips that arrive at the AMADYNE production and inspection systems (Wafer, Tape etc.) – they have undergone a prior production job which is subject to risk and so the chance potential damage cannot be excluded.
PHASE TWO. MICROCHIP GETTING HOUSED.
The second phase takes place on the workspace of the AMADYNE systems. Like the prior process there is full automation, great complexity but no risk. Components must be removed from wafer or tape, then housed, bonded etc. Today several options are standard such as Single Chip (SC), Multichip Module (MCM) and Flipchip (FC). Parts showing damage are detected automatically and sorted out. There is more information: here.
The next-to-zero risk on our systems is a paramount sales argument for AMADYNE machines. As a matter of fact if there is discard it has origin only in the component delivery, not in the assembly processes. Our understanding of quality.
The Single Chip.
Quite Common. Quite Classical. Much in Demand.
CHIP ON SUBSTRATE. QUITE SIMPLE IN THE FIRST PLACE.
The definition is simple: bonding just one component on just one substrate is called a ‘single-chip product’. Classical examples are small LEDs, pressure sensors, classical ICs and most of CPUs and MCMs.
ON SECOND THOUGHT NOT SO EASY.
For a typical SC-application only one set of tools and material feed is required. As a matter of fact such an application is not very challenging. However, when there is just a bit more requirement (such as a special process, a special adhesive, documentation, inspection etc.) simple and lower cost machines fall far behind systems like AMADYNE machines.
Multichip Module (MCM).
Perfect microchip assembly in a single work operation.
SEVERAL DIFFERENT COMPONENTS ON ONE MCM.
On a single MCM many microchips can be positioned and the system is able to accomplish such jobs in one work operation only. This requires a great deal of software intelligence and hardware capabilities. In addition, diverse components need diverse tools necessary which are made available by the machine.
PROFESSIONAL SUPPORT BY OUR SYSTEMS.
AMADYNE systems support an automatic change process with up to 20 pick- up tools, the feeding of up to 36 x 8mm SMD Tapes, Wafer, Waffle Packs, Gel Packs, JEDEC-Trays and more. The complete Work Space can be made available for component feeding (e.g. 40 waffle packs). The optional Magazine Lift can support operations with up to 250 x 2? waffle packs or 15 wafers (also mixed). With this comprehensive support any demanding production job can be realized.
Less Wire-Bonding. More Flip Chip Assembly.
Wiring loses its importance the smaller the components get.
BUMPS INSTEAD OF WIRES. THAT’S MORE (TOMORROW’S) STATE-OF-THE-ART.
Today still a majority of all worldwide produced microchips come in their housed form as wired chips. But as the components grow smaller and smaller the elimination of the wires is much more advantageous for some industry production. Hence, the use of more complex assembly processes seem rational. The flipchip technology is the solution. Small bumps are used to connect the chip with the substrate while being rotated (flipped) face down.
PERFECT ASSEMBLY. THE AMADYNE FLIP STATION.
We offer the basic tool and controlling conditions for simple flipchips. With our more universal flip-station components can be rotated within a range of 200µm to 30mm edge lengths irrespective of the source (wafer, tape, wafflepack). Assisted by the dipping unit the bumps can be precisely coated with solder or flux and in the next step be inspected and finally assembled.
Connection Technology.
How to Professionally Attach Parts.
Perfect microchip assembly by AMADYNE.
CONNECTION TECHNIQUES ARE MANY-SIDED …
By the term connection technique we summarize functions like Dispensing, Stamping, UV-Curing and Soldering. A dispensing job is defined as bonding by the use of Adhesives. There are several dispensing techniques: pressure/time dispenser, volume dispenser and jet dispenser. Stamping is a technique which is used for the definition of very small and constant adhesive volumes when dispensing has reached a certain limit. Adhesive Application is operated through a pin transfer.
… AND RESPOND TO VARIOUS DEMANDS.
UV-Curing is another method. Here users care for fast-hardening – an important operation for immediate transport jobs. Soldering is a thermal procedure. Users can choose between several alternatives here. Profiles can be produced any time.
Adhesive Application: Dispensing.
Precise chip and substrate joining.
WHICH BONDING TECHNIQUE IS THE RIGHT ONE?
To use adhesives for bonding jobs is quite common nowadays. To apply an adhesive to create a mechanical bond AMADYNE customers can make use of our mature Dispensing-system, our Stamping or our Dipping Unit.
IT’S DETERMINED BY THE JOB.
The adhesive application comes as a three-fold selection:
the pressure/time-dispenser type
the volume-dispenser type
the jet-dispenser type
The adhesive (stored in a cartridge) is applied on the substrate directly by use of a needle (dispense needle). With respect to the kind of substrate or the kind of job users must make a choice between these three types.
Adhesive Application: The Stamping Unit.
This unit is required for very small components.
WHAT THE STAMPING UNIT’S JOB IS.
As components grow smaller and smaller the application of tiny and constant Adhesive volumes gets more and more important. Where usual Dispensing reaches its limits the stamp unit comes into the game. Users can acquire such units in various forms: as a manual / motoric layer thickness adjustment, temperature-adjusted (cooled down) or flooded by gas (e.g. N2).
HOW THE PROCESS IS OPERATED.
The adhesive application is managed by a pin-transfer. In a pot the layer thickness is controlled by the level adjustment of the squeegee. With a stamp tool the systems collect the adhesive and transfers it onto the substrate. The tool design and the adhesive level in the pot determine the transferred volume. With this technique even smallest adhesive volumes can be applied.
Professional Handling of Freshly Produced Substrates.
Adhesive, Hardening & Shock Protection.
IF YOU SHOULD BE IN A HURRY …
To harden common adhesives time is needed and often the use of temperature influence is also required. This means freshly assembled components are not fit for transport or other activities where any form of movement is a condition. There are many situations where the assembled production result must be kept unmoved for some time. If customers can’t spare this time UV curing is the right solution.
… E.G. FOR IMMEDIATE TRANSPORT AFTER FINAL PRODUCTION.
UV curing works like this: during the process when the component is still in hold of the tool strong UV-LEDs harden the special UV-adhesive within seconds. After this job the assembled result cannot change anymore. There’s an alternative process where the hardening is processed in a special station – parallel to the general assembly.
Fully Automatic Soldering.
Elegant, User-Friendly & Perfect. As You Like It.
THE AMADYNE-SOLDERING STATION IS INDEED VERY FLEXIBLE.
During the soldering process components are bonded by the use of a thermic process. The connection can have a mechanical and an electrical function and be used as a heat conductor. The substrate (or many substrates) can be placed into the soldering station automatically. In case the solder has already been transferred to the substrate or onto the component the latter one will be placed on the substrate.
ELEGANT SOFTWARE CONTROL DESIGN. DIVERSE PROFILE DEPOSITS. AND MORE.
As an intermediate step the solder coating can be performed as Dispensing, Stamping, Dipping or as preform. The software allows to deposit a temperature profile. In addition the process space can be closed and flooded with inert or process gas. It is also possible to keep the component in place by the use of a heated tool. After the thermal process the finished package is automatically ejected and the station is made ready for the next step.
Special Processes.
Processes Must Be Well-Thought Out.
Both in a technical and economical respect.
SPECIAL OFTEN MEANS: MORE OPTIONS.
Whatever you may require from us. We have it, or we make it. The special processes are quite good expressions of this very company philosophy. And we know that many clients are looking for solutions embracing a certain degree of multifunctionality. The latter has got this very kind of charm to save time and money. That’s our contribution to more customer satisfaction.
IF YOU CAN GET MORE WHY ACCEPT LESS?
As we think with our client’s head we know it is wise to give him more. We have, hence, integrated a great deal of special processes such as Probing, Probing & Sorting, Inspection. We asked ourselves years ago: if diverse components are processed on our systems, diverse types of production are offered as well – why then should it be not possible to inspect components, too? It appeared only logical to us and we started to enrich our machines accordingly. Everything subject to the idea of automation. As Professionals in Automation would always do.
The Globtop-Process.
Protection for Sensitive Parts by Special Conformal Coating.
GLOB TOP CAN BE LESS EXPENSIVE …
The glob top process is designed for the protection of very sensitive components such as chips, wire-bonds etc. Usually COB-circuits these items are coated by a special material. It is less expensive in some applications and also less space consuming compared to a complete encapsulation.
… AND LESS SPACE CONSUMING (COMPARED TO A COMPLETE ENCAPSULATION).
Standard dispensing devices support this process. Special software comes into the game. It enables the system to realize a comfortable filling of larger volumes. By the glob top solution AMADYNE can once more protect their customers’ investments – a strong argument in today’s business life.
Electric Measurement. A la carte.
We fulfill each requirement.
THE ELECTRIC MEASUREMENT IS AN ALTERNATIVE.
An electric measurement can (in some cases) be the simpler alternative to the Qualifying Image Processing which is designed to detect eventual component damage before a process starts. With the electronic measurement alternative users can test e.g. LED during the off-sorting process and categorize by voltage or brightness criteria.
WE CAN ALSO PRODUCE YOUR CUSTOMIZED VERSION.
Probing is a classic example for the External Module Integration. As a Customization job we integrate Measurement methods clients have either recommended or delivered to us (Source Measurement Unit, Power Meter, Network Analyzer, Spectrometer). We can also develop and create special measurement methods (e.g. Probing station) customers prefer and order us to make a part of their solutions.