Die Attach via Dispensing, Stamping and Dipping.
The Adhesive Application. A Challenge requiring Perfect Accurateness.
Unhoused Microchips require a dedicated way of attaching them to a substrate.
These kinds of attachment are controlled by our various Adhesive Material Application functions.
System devices and associated software control is here: adhesive application.
Some important key words in this respect are Pressure-/Time dispenser, Jet Dispenser, Volume Dispenser, adhesive level, squeegee, Stamp Tool, adhesive layer thickness, pin transfer, bumps and Dipping Unit.
Professional Adhesive Application.
Adhesive Application: Dispensing.
Precise chip and substrate joining.
WHICH BONDING TECHNIQUE IS THE RIGHT ONE?
To use adhesives for bonding jobs is quite common nowadays. To apply an adhesive to create a mechanical bond AMADYNE customers can make use of our mature Dispensing-system, our Stamping or our Dipping Unit.
IT’S DETERMINED BY THE JOB.
The adhesive application comes as a three-fold selection:
the pressure/time dispenser type
the volumetric dispenser type
the jet dispenser type
The adhesive (stored in a cartridge) is applied on the substrate directly by use of a needle (dispense needle). With respect to the kind of substrate or the kind of job users must make a choice between these three types.
The pressure-/time-dispenser type.
This type excels with its technology using pressure on the cartridge during a defined slot of time. There are three parameters by which the process is controlled. The pressure definition, the needle aperture and the process speed. By these tree parameters the adhesive volume is defined.
The Volume-Dispenser Type.
This professional dispenser type injects media by spindle and spiral support. Spindle drive, spindle inclination and process speed determine the adhesive volume. A good adhesive volume repeatability is also possible with this type.
The Jet-Dispenser type.
This professional dispenser type works with tappet and nozzle support to put adhesives on the substrates. In this application the distance between nozzle and material has a minor importance. The adhesive volume to be injected is determined by the tappet stroke’s level and the duration of itsopening. We purchase these devices from professional manufacturers.
The Adhesive Application is Managed by a Pin-Transfer.
Adhesive Application: The Stamping Unit.
This unit is required for very small components.
WHAT THE STAMPING UNIT’S JOB IS.
As components grow smaller and smaller the application of tiny and constant Adhesive volumes gets more and more important. Where usual Dispensing reaches its limits the stamp unit comes into the game. Users can acquire such units in various forms: as a manual / motoric layer thickness adjustment, temperature-adjusted (cooled down) or flooded by gas (e.g. N2).
HOW THE PROCESS IS OPERATED.
The adhesive application is managed by a pin-transfer. In a pot the layer thickness is controlled by the level adjustment of the squeegee. With a stamp tool the systems collect the adhesive and transfers it onto the substrate. The tool design and the adhesive level in the pot determine the transferred volume. With this technique even smallest adhesive volumes can be applied.
An Even Coat of a Defined Medium is Guaranteed.
Applying Adhesives. The Dipping Unit.
Flip Chip-Automation made perfect.
THIS IS THE DIPPING UNIT’S FUNCTION.
The dipping unit’s main role is to become active around flip-chip procedures. Before the actual assembly job starts bumps can easily be applied with an even coat of a defined medium. The dipping unit is also suitable for a 100% fillet application with tiny adhesive volumes. The unit can be ordered as a manual or automatic version.
THE FUNCTION OF THE AUTOMATIC VERSION.
The automatic version has a controlled adhesive application and an interval smoothing of the medium surface. The process is as follows: the components are dipped face down into a pre-defined layer of adhesive, covered with a medium and finally deposited onto a substrate. By means of the automatic version the medium surface is smoothened before the next component is fed into the process. Hence, the volume of adhesive is always the same and so is its level.