Quite Multipurpose. But Their Main Focus is Quality, Speed & Cost Control.
COMPONENTS AND PROCESSES.
With the Single Component Tracking function (SCT) AMADYNE offers a complete system observation option. Users can track single process steps from an upper to a lower level. Process Data Recording is a feature by which all important core values can be traced and made a basis for the total cost-performance calculation of a production.
The Broad Spectrum of Inspection.
THE PLACEMENT OF COMPONENTS.
Let’s take our Post Place Inspection function: it’s got a telling name and, hence, its job is to accomplish tasks that become quite important after the placement of components. Like the rotation by x degrees and similar activities. Inspection as a term is used by us in a general connotation of the word in the first place. On lower connotative levels we distinguish between Probing & Sorting, Particle Inspection, Chipping Inspection and more. Probing & Sorting gets its importance from the inspection of defect components in an initial phase of a production.
Single Component Tracking (SCT).
Detailed Process Tracking.
Small components require profound care. AMADYNE systems offer a superior solution.
IMPORTANT IN INDUSTRIES WITH VERY SPECIFIC REQUIREMENTS.
Especially in industries which require highest chip quality as components form parts of very critical products there (Aerospace, Health Industry etc.) it is inevitable to record and document complete material flows. From a software perspective SCT (single component tracking) and our Identification methods work hand in hand. The AMADYNE Image Processing makes it possible to e.g. identify very clearly components with 2D or printed codes.
DEATAILED TRACKING DOWN TO COMPONENT LEVELS IS NO PROBLEM.
Each production process and each associated material flow can meticulously be tacked down to the level of a single chip and be saved in a database or network data structure. Moreover, it is possible to register job account numbers, adhesive charges and other specific values manually or by hand scanner and to add these to the system’s documentation.
Generally Speaking, Documentation Isn’t A Bad Idea. In Microchip Assembly it’s a Great One.
The practical benefit of a complete process documentation cannot be overestimated.
THE GREAT IMPORTANCE OF TECHNICAL FIGURES.
Figures are important. This is true for business figures and for technical figures as well. In a technical respect we learn from them about the products’ quality and about the production process. Features like Post Place Inspection produce such precious information.
THE GREAT IMPORTANCE OF BUSINESS FIGURES.
Technical figures once reflected with other (business) numbers give customers a great advantage for planning and production. Technical and business data clusters produce basic parameters used for running whole companies. Customers pay more attention to technical data these days as automation is increasing and cost calculations appear in a better shape. This is why AMADYNE is keen on delivering much of this kind of data such as set-up and production time, up and downtime by hour day and week. And there is more: production unit time, MTBA or MTTA. Good opportunities for optimization of productivity and availability by the way.
Individual Inspection Methods on Demand.
Even the smallest defect can’t escape unnoticed.
By the term ‚inspection‘ we understand methods leading to results which determine whether a component stays in the process or not. Components that have been identified as not optimal quality are sorted out from the very beginning.
AMADYNE offers standard and customized image processing functions which can safeguard optimal quality. These are the standard methods:
PARTICLE INSPECTION. Particles and structural damages on surfaces are detected by comparison of several reference images, so called ‘golden samples’. The results are displayed both as text and graphic documentation. Users can individually determine sensibility and minimal sizes of the defects to be detected.
CHIPPING INSPECTION: Chip handling and separation are jobs that are sometimes prone to create small damage. Material disruption especially at edges are consequently analyzed, quantified and documented. Should there be a transgression of a defined limit of an edge disruption, the detected component is excluded from further production.
More types of inspection are subject to customization orders.
Following Component Placements Sensible Customers Do a Retesting.
Running special applications this is more or less a requirement.
CHECKS AND BALANCES. PLUS INVESTMENT PROTECTION.
It is appropriate if users see a risk with even slightest deviations from normal (100%) conditions of components. In life you have to compromise but never in the microchip assembly arena. It is a part of our Philosophy. Our clients think that way, too. They know the limits of the human brain in this respect and rely on a machine’s (software) capability that has been created just for that purpose: to inspect thoroughly.
POST PLACE INSPECTION. MORE ACCURACY. BETTER QUALITY. LESS COST.
Components are inspected immediately after the assembly process towards their correct rotation and exact position. Each result is documented. Each limit exceeding is reported be it as small as possible and associated production processes are terminated in the wake of these findings. The correction of the measured result can be saved and used for the process continuation.
Probing & Sorting.
Testing & Sorting According to Voltage or Brightness Criteria – e.g. LEDs.
THE ELECTRICAL MEASUREMENT ADVANTAGES …
Similar to the qualifying image processing per inspection where eventual damage is detected before a production process start the electrical measurement can be the better (and sometimes the simpler) alternative. Users can test LEDs during the off-sorting process and also sort according to voltage and brightness criteria. As far as customization is concerned we can integrate either customer-provided or customer-selected measurement techniques such as source measurement unit, spectrometer etc.).
Also a customer-provided or a customer-ordered probing station can be implemented and connected to the system in a way that a seamless unification with our One-Stop-Control device (one monitor only) is realized.
… CAN BE DECISIVE AND BE OF GREAT BENEFIT.
The results from inspection, electrical measurement or wafer mapping can be used to exclude components from further production (filter). In addition there is an extensive documentation of all measurements (SCT). Further, components can be placed in different location with respect to their analyses.